The standard outlines specific test schedules to validate performance, including:
The IEC 60352-5 document establishes precise structural parameters that must be met to achieve standard compliance. 1. Plated Through-Hole (PTH) Dimensions
IEC 60352-5 offers a reliable framework for solderless wound connections used in electromagnetic components. Its strength lies in clear pass/fail criteria for environmental and mechanical stresses. However, successful application requires understanding the metallurgical interaction between wire and terminal, proper winding tension control, and suitable post-plating selection. When these factors align, the wound connection achieves contact resistance and mechanical stability comparable to welded joints, without heat-induced damage to magnet wire insulation.
The standard, titled "Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance," provides the international specifications for press-in technology used in electronics manufacturing.
To claim compliance with IEC 60352-5, manufacturers must subject their press-in connections to a rigorous matrix of environmental and mechanical tests. Environmental Stress Testing iec 60352-5 pdf
According to the official text of the standard, the objective is “to determine the suitability of press‑in connections under mechanical, electrical and atmospheric conditions as specified by the manufacturer of the press‑in termination and to provide a means of comparing test results when the tools used to make the connections are of different designs or manufacture”. In plain words, IEC 60352-5 does not tell you how to design a press‑fit pin; it tells you how to prove that a given pin, when pressed into a given board hole under controlled conditions, will perform reliably over its intended life. It also ensures that test results are comparable even if different assembly equipment is used.
The final internal diameter after surface finishes (e.g., Immersion Tin, HASL, Immersion Silver, or ENIG). 2. Surface Finish Requirements
) to verify that the contact zone remains strictly gas-tight and free from oxidation. Microsection Analysis
Designers, quality managers, and manufacturing engineers frequently look for the official PDF document to access: Exact mathematical formulas for calculating hole sizes. Step-by-step qualification testing sequences. The standard outlines specific test schedules to validate
Soldering has long been the default method for making connections on printed circuit boards, but the modern manufacturing world has a strong preference for faster, cleaner, and more cost‑efficient alternatives. One of the most robust alternatives is press‑in technology, which eliminates thermal stress on the board, simplifies assembly, and creates connections that are just as reliable as their soldered counterparts. The technical backbone for qualifying and verifying these connections is .
When looking into the standard, it is critical to know which version or edition you are referencing.
: Monitoring contact resistance to ensure high-quality signal and power transmission. Environmental
This public link is valid for 7 days and shares a thread, including any personal information you added. This link or copies made by others cannot be deleted. If you share with third parties, their policies apply. Can’t copy the link right now. Try again later. Its strength lies in clear pass/fail criteria for
The current 5th edition (2020) has . Earlier editions, such as the 2008 version, had 72 pages. The reduction in page count is partly due to the removal of obsolete tables and the bending test.
: Updated copper thickness limits for plated-through holes to match current market manufacturing practices. iTeh Standards For official access, you can find the full document on the IEC Webstore or through regional standards bodies like BSI Knowledge environmental aging sequences defined in the standard?
[Visual Inspection] ➔ [Electrical Resistance Test] ➔ [Environmental Conditioning] ➔ [Final Testing] Initial Electrical Tests