Micron - Memory Part Number Decoder

1. Understanding the Micron Part Number Structure (DRAM Component)

On smaller memory chips, there is not enough physical surface area to print the full 12 to 18-character part number. To solve this, Micron prints a , known as the FBGA code .

Subsequent optimization shrinks (e.g., E-die or B-die), which often feature different overclocking ceilings and thermal profiles. Decoding Micron Flash and SSD Part Numbers

: Ensure you are reading the printed part number on the chip surface, not the tracking lot code or date code (which are usually shorter and change per batch).

Look at the physical component. The second 5-digit code (often starting with a letter/number mix) is the FBGA code. Use the . Enter the 5-digit code in the "FBGA Code" field. micron memory part number decoder

Understanding the Micron Memory Part Number Decoder Micron Technology utilizes a sophisticated part numbering system that provides detailed specifications for every memory component, from consumer DRAM to enterprise SSDs. Because physical space on a chip is limited, Micron also uses abbreviated (often starting with "D9") to identify parts on the manufacturing floor. 1. Decoding FBGA Marking Codes

Indicates the total capacity of the chip package (e.g., = 128 Gigabits, 1T = 1 Terabit). Keep in mind this is in gigabits, not gigabytes (8 Gigabits = 1 Gigabyte). 3. Device Configuration (08)

MT40A512M16LY-075E:E → DDR4 family; 512M x16 (8Gb die); LY = package/IO; -075 = speed grade (~DDR4-2400–2666 class); E = commercial; final :E = revision.

You may see trailing codes like AIT , B , or M . Subsequent optimization shrinks (e

: Identifies the maximum clock speed or data transfer rate.

Separated by a colon ( : ), the final letter represents the manufacturing generation (die shrink) of the silicon. : First generation silicon :E : Mature, optimized silicon generation :G : Advanced sub-node generation NAND Flash Part Number Breakdown

In our example, signifies DDR4 SDRAM (the "A" indicates the specific generation or architecture variant). 3. Density Configuration

A standard Micron part number follows a specific hierarchy. For instance, in a DDR4 or DDR5 component, the segments typically represent: Manufacturer (MT = Micron Technology) The second 5-digit code (often starting with a

TLC (Triple-Level Cell) technology or specific architecture marker AB: Multi-die package configuration layout A: Generation revision WP: TSOP package type The Micron FBGA Code (The 5-Digit Solution)

found physically on memory chips. To bridge this gap, Micron provides the FBGA and Component Marking Decoder

: Micron Solid State Drive (e.g., 2400, 3400, or 7450 SSD series).

If you look directly at a physical Micron RAM chip, you will rarely see the full part number printed on it. Because memory chips are physically small, Micron prints a short known as the FBGA Part Marking (or "FBGA Code"). How to use the FBGA Code:

To alleviate the challenges of decoding Micron memory part numbers, Micron provides a valuable resource called the Micron Memory Part Number Decoder. This decoder is a web-based tool that allows users to enter a Micron memory part number and retrieve detailed information about the memory module.